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Rough Ingot Inspector SC-Ingot-LR is mainly used for inspecting long rough ingots, including detection of cracks, diameter, length, stress, twins, dislocations, etc. The equipment can be combined with a marking machine to achieve fully automatic rough ingot marking, enabling complete automation from crystal pulling to cutting. It replaces traditional manual measurement and marking, greatly saving labor and improving accuracy, avoiding material waste caused by reverse cutting of the ingot tail.
Device image 1
Device image 2
Device image 3Replaces traditional manual measurement and marking using steel rulers or tape measures, greatly saving labor and improving marking accuracy, avoiding material waste caused by reverse cutting of the ingot tail. The equipment can automatically mark and interface with MES to upload marking positions.
Fast inspection, automatic docking with AGV, no manual handling required, achieving full process automation from crystal pulling to cutting machine.
Complete all inspection items in one go, automatically draw physical lines.
Detects stress, cracks, dislocations, twins, crystal line, diameter, length.
Accurately cut off the tail, avoiding undercutting (multiple re-cuts) or overcutting (material waste).
Draw physical lines on the ingot, interface with MES to upload marking positions.
Automatically dock with AGV, no manual handling, improving efficiency.
Uses backlight profilometry, unaffected by silicon rod surface reflection and ambient temperature, no need for frequent exposure adjustments, stable detection, service life up to 10 years. Overcomes the disadvantages of traditional 3D measurement methods such as short laser life and susceptibility to interference.
Through internal characteristic detection, it can distinguish between high-stress and low-stress areas, independent of surface dislocation lines and crystal line fracture positions. Accurately determine the cutting position based on the stress map, ensuring the rod does not crack after cutting, superior to traditional marking specifications.
Can reflect resistivity distribution through images without contacting the rough ingot, providing additional material characteristic data.
| Parameter | Specification |
|---|---|
| Model | SC-Ingot-LR |
| Infrared Camera | 1k line scan |
| Dimension Camera | 4K |
| Detectable Types | Crack, diameter, length, stress, twin, dislocation detection, etc. |
| Diameter Detection Range | 200-350mm |
| Length Detection Range | 500-7500mm |
| Diameter Detection Accuracy | ±0.5mm |
| Length Detection Accuracy | ±0.5mm |
| Diameter Data Display | Max, min values (all diameter data of the rod can be output) |
| Crack Detection | Positioning accuracy ±1mm, cracks with length ≥1mm can be detected |
| Marking Specification | Mark according to stress (compatible with traditional marking rules) |
| Test Platform | Windows |
| Power Consumption | 800W |
| Input Voltage | AC 220V |
| Computer | DELL |
| Monitor | 2K monitor |
| Data Storage | 100,000 images |
| Inspection Object | Rough ingot to be cut |
| Weight | 1000kg |
| Operating Temperature | -30℃~80℃ |
| Relative Humidity | ≤85%RH |
The rough ingot inspection machine makes ingot cutting more precise, saving factories a large amount of human resources and reducing waste of ingot tail material. Through non-contact measurement, unique stress algorithms, and non-contact resistivity analysis, it achieves efficient, stable, and accurate fully automatic rough ingot inspection and marking, supporting the intelligentization of the entire photovoltaic silicon ingot processing workflow.
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