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EPL Inspection Equipment is the first product in China independently developed by Vision Potential, based on traditional PL technology, with EL-level inspection and imaging capabilities. Unlike traditional PL and EL inspection equipment that suffer from single-function limitations, EPL can compatibly and accurately identify various defects such as minority carrier and series resistance related defects in cells, breaking the limitations of single-device inspection through technological integration.
Integrating PL (Photoluminescence) and EL (Electroluminescence) dual inspection technologies, it constructs an integrated inspection system: deeply exploring intrinsic defects in the non-energized state while accurately diagnosing electrical performance issues. It runs through the entire lifecycle of photovoltaic products from R&D to mass production.
SC-EPL Device DiagramNon-contact inspection, probe-free, near-zero breakage rate
Full coverage of cracks/broken grid/cold solder/black spots/concentric circles
Series resistance imaging superior to traditional EL, higher accuracy
Automatic yield statistics, closed-loop alarm with production line
Integrated AI detection algorithm, quickly set defect standards
Integrated Windows host software, one-click parameter configuration
RGB three-channel color imaging, enhanced detail resolution efficiency
Compatible with PERC/TOPCon/HJT/xBC and other high-efficiency cells
Plug-and-play for online/offline machines, customized rails
Fully compatible with half-cells/full cells 156~210mm
Covers online/offline inspection throughout the cell production process, core configuration for cell sorters.
Defect detection in lamination, soldering, junction box assembly processes; key equipment for string soldering inspection.
Core test tool for performance analysis and process optimization in PV material and cell technology R&D.
Doping uniformity, edge over/under etching, PN junction anomalies; passivation effect; broken grid/faint printing/shorts/cracks.
Minority carrier lifetime + defect distribution + EL electrical performance, multi-dimensional grading (A/B/reject), ensuring module consistency.
Defect analysis before/after lamination, string soldering defects, secondary lattice damage, EL+PL dual report.
Analysis of series resistance/minority carrier defects, intrinsic material properties/electrical performance, process parameter iteration guidance.
| Parameter | Specification |
|---|---|
| Model | SC-PLEL-PS (SC-EPL Series) |
| Camera Specifications | NIR enhanced, 1MP, exposure 10μs~10s, response 400-1200nm |
| Infrared Pixels | 1MP |
| Lens Specifications | HD wide-angle 16/25/45mm optional, FOV ≥80° |
| Light Source Specifications | Semiconductor laser, main wavelength 808±5nm |
| Spot Uniformity | ≥90% (within effective detection area) |
| Exposure Cycle | 200μs~1000μs, step 1ms adjustable |
| Detection Wavelength Range | 900~1300nm (for crystalline silicon) |
| Compatible Sizes | 156×156mm ~ 210×210mm (half/full cells) |
| Inspection Objects | Crystalline silicon cells (PERC/TOPCon/HJT/xBC); bare, with film, encapsulated modules |
| Detectable Defect Types | Cracks, broken grid, fragments, scratches, cold solder, over-etching, black spots, concentric circles, low-efficiency cells, contamination, etc. |
| Stage Size | Adaptable to automated tracks (customizable) |
| Control Method | Proprietary host software fully automated control |
| Detection Accuracy | Crack width > 50μm detectable |
| Imaging Accuracy | ≥0.2mm/pixel |
| Focus Mode / Distance | Manual focus / 400-650mm |
| Hardware Mount | Aluminum profile, sheet metal |
| Inspection Time | 0.5s~2s (based on automation cycle) |
| Test Platform | Windows + standard AI inspection software |
| Power | 500-1000W |
| Power Supply Protection | Reverse current/overload/leakage/ESD/overheat protection |
| Computing Device | Industrial computer |
| Ambient Temperature | 15-50℃, Humidity 30%-70% (non-condensing) |
| Equipment Weight | Approx. 20kg (actual product prevails) |
| Dimensions | 400×350×600mm (L×W×H) |
| Power Supply | Single-phase AC220V±10%, 50HZ±1HZ |
| Defect Type | EPL Imaging | EL Imaging | Imaging Analysis |
|---|---|---|---|
| Misalignment |  |  | Comparable to EL imaging capability, accurately captures series resistance defects, with stable or even better imaging performance, meeting core misalignment detection needs. |
| Broken Grid |  |  | Using three-channel imaging technology, broken grid defects are clearly outlined with higher recognizability, results are intuitive and easy for quick defect judgment. |
| Multiple Defects |  |  | No probe interference, green box areas cover all defects without omission, red box areas highlight broken grid features, accurate detection of multiple defect types. |
| Slight + Severe Broken Grid |  |  | EPL shows slight broken grid more clearly, can detect incomplete breaks not recognized by EL, while also clearly presenting severe broken grid defects. |
Self-developed AI algorithm — Quickly set defect types and detection criteria, stronger accuracy and adaptability
Integrated Windows platform software, one-click configuration, low operation threshold
Real-time data communication, production line alarm/stop/rejection linkage
RGB three-channel color imaging, more accurate manual resolution
Automatic statistics of defect ratio/yield, aiding process optimization
Compatible with cell/module lines, flexible online/offline deployment
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