Vision Potential Ingot Inspection System: Ushering in a Fully Automated Era for PV Silicon Rod Inspection & Scribing

In photovoltaic wafer production, the accuracy of ingot inspection and scribing directly impacts cutting yield and material cost. Traditional manual measurement with steel rulers is inefficient and often leads to tail-end waste due to reverse cutting. Vision Potential introduces the Ingot Inspection System SC-Ingot-LR, integrating crack, diameter, length, stress, twin crystal, and dislocation detection, plus fully automatic scribing when paired with a scriber. Furthermore, enterprises can expand with the Square Ingot Inspection Module to cover square ingots, building a complete intelligent bar inspection solution.

Vision Potential Ingot Inspection System

One-Stop Automated Inspection & Scribing

Designed for long round ingots (500-7500mm), the non-contact measurement system automatically performs:

Full Defect Detection：Accurately identifies cracks (≥1mm, positioning ±1mm), dislocations, twins, and grain line anomalies.

High-Precision Dimensional Measurement：Diameter 200-350mm ±0.5mm, length ±0.5mm.

Auto Scribing：Draws physical lines based on stress distribution or conventional rules, and uploads scribing positions to MES for seamless connection with cutters.

Ingot Stress Inspection Equipment: Proprietary Algorithm for Precise Cutting

As an Ingot Stress Inspection Equipment, the SC-Ingot-LR features a unique stress detection algorithm that distinguishes high/low stress zones through internal characteristics, independent of surface dislocation lines or grain line fractures. The stress map guides precise cutting positions, preventing post-cut cracking and outperforming traditional scribing rules, significantly reducing tail-end rework waste.

Technical Advantages: Backlight Profiling + Non-Contact Resistivity

Conventional 3D measurement suffers from short laser life and environmental interference. Vision Potential’s ingot inspection system adopts backlight profiling, immune to surface reflection and temperature variations, requiring no frequent exposure adjustments, with a service life exceeding 10 years. It also integrates non-contact resistivity analysis, mapping resistivity distribution via imaging to provide additional material property data.

Fully Automated AGV Integration & Square Ingot Inspection Module Support

The system supports fast inspection and automatic AGV docking, eliminating manual handling and enabling full automation from crystal pulling to cutting. For square ingot needs, the optional Square Ingot Inspection Module works seamlessly with the round ingot inspection system, covering various bar shapes and empowering comprehensive smart factory upgrades.

Core Value Summary

Cost & Labor Reduction： Replaces manual measurement and scribing, prevents tail-end waste.

Precision & Reliability：Stress-guided cutting, crack detection accuracy ±1mm.

Smart Connectivity：Interfaces with MES and AGV, stores up to 100,000 images for full traceability.

Vision Potential’s ingot inspection system, with non-contact measurement, precise stress recognition, and modular expandability, drives PV silicon rod processing into a new era of high precision, full automation, and zero waste.